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Products

Consumables

We are constantly expanding our range of Materialography Consumables and Equipment to better support our clients' Failure Analysis or R&D laboratories.


Sectioning

Abrasive Cut off Wheel

Abrasive Cut off Wheel

A wide selection of abrasive Cut-Off Wheels engineered for a variety of materials and applications.

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Diamond Wafering Blade

Diamond Wafering Blade

For cutting greater precision and thin sectioning capability or extremely brittle microelectronics to extremely hard ceramics. Blades vary in diamond grit size, concentration, and blade size.

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Mounting

Hot Mounting

Cold Mounting Resin

Hot and Cold Mounting

Mounting encapsulate the specimens in a resin for convenient and safer handling and to improve edge rentention leading to improvement in preparation result.

Typically, there are 2 types of mounting:

Cold Mounting - Room temperature mounting resins which typically require a mixture of resin and hardener.

Hot Mounting - Designed for mounting at elevated temperatures and pressures in compression mounting presses.

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Sample Clips and Two-parts Plastic Moulding cups

Mounting Accessories

Sample Clips - To support samples while the mounting material cures.

Two-parts plastic Moulding cups - Reusable mounting cups with diamter 1, 1.25 and 1.50 inches.


Grinding/Polishing

Silicon Carbide Grinding Paper (SiC)

Silicon Carbide Grinding Paper (SiC)

A very hard and sharp abrasive for cutting metals and polymers. Typcially used for plane and fine grinding of materials with hardness <150HV. For very coarse removal, zironica which is a tougher abrasive than SiC, is prefered. Diamond grinding disc is recommended for all materials with hardness >150HV.

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Diamond Grinding Disc (resin or nickel boned)

Diamond Grinding Disc (Resin or Nickel boned)

For grinding hard materials including ceramics, metals, aerospace or thermal spray coatings and petrography specimens. The sharp diamond particles cut cleanly with no edge rounding. It comes with different bonding (nickel bonded for grinding, resin bonded for polishing) , grit size and can be purchased with PSA backing.

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Lapping Film (Diamond, Silicon Carbide and Alumina Oxide)

An ultra fine, dispersed, uniformly-coated abrasive product on polyester film backings to provide precision finishes. Typically used for polishing fiber optic connectors, rigid memory disks, texturing thin film disks, roll superfinishing, ceramic seals and flat lapping applications. The main characteristic of lapping films is that they produce very flat surfaces, especially across materials having a wide range in hardness. Lapping films are available in different mineral types and micron sizes.

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Polishing Cloth/Pads

Polishing Cloth/Pads

For an accurate presentation of the true microstructure, the damage produced during sectioning must be eliminated. We have a wide selection of polishing cloths to match the appropriate abrasive for your samples. All our cloth/pads are sourced from USA manufacturers that can match the likes of Struers, Buehler or Leco.

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Diamond Polishing Slurry

Polishing Slurry

Diamond Polishing Slurry - Water-based monocrystalline diamond slurry produces enhanced surface finishes, reproduceable results and environmental friendly.

Alumina Polishing Slurry - High purity alumina slurry designed for polishing of most Metallographic specimens. It is easy to used and are consistent in performance.

Colloidal Sillica - An excellent final polishing solution for producing scratch-free specimens on many materials which utilizes a chemical/mechanical effect where the surface of the material is chemically altered while very fine silica particles ranging from 0.02 - 0.06 micron remove the altered layer.

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Replica material

Replica Material

Replicate surfaces of etched micro-structure surfaces with precision that deviations lower than 0.1 µm on site for subsequent examination in the laboratory

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Equipment

Currently, we are broadening our range of equipment. For enquiries, please email us.


Sectioning

Printed Circuit Board Diamond Saw Machine

Printed Circuit Board Diamond Saw

A work horse for isolating components from the Print Circuit board.

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Printed Circuit Board Diamond Saw
Diamond Wire Saw Machine

Diamond Wire Saw

To selectively isolating a component from a Print Circuit board

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Diamond Wire Saw
Diamond Band Saw Machine

Diamond Band Saw

Simple construction with few moving parts and affordable sectioning machine. Excellent for non-linear cutting of materials such as glass, printed circuit boards, electronic packages, substrates, polymers and other non-metallics. Coolant is drawn from the reservoir by the blade and applied to the sample.

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Diamond Band Saw
Band Saw Machine

Band Saw

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Grinding/Polishing

Manual Grinding/Polishing Machine

8" Manual Grinding/Polishing Machine

8" ( 200mm) Variable Speed Grinder/Polisher which is perfect for Production and R & D facilities on a Budget. This machine requires minimum maintenance and much easier to use then Fully Automatic Grinding/Polishing Equipment.

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